News and Knowledge Portal for Identity Verification Professionals

collapse
...
Home / Players / Trust Stamp joins EU semiconductor initiative to build biometric identity into chips
Trust Stamp joins EU semiconductor initiative to build biometric identity into chips

Trust Stamp joins EU semiconductor initiative to build biometric identity into chips

2026-07-25  Per Henrikson

Trust Stamp’s Malta subsidiary secured the spot with support from Malta Enterprise. Its job: develop biometric identity binding that links verified human identities directly to semiconductor devices. The company’s contribution to IPCEI AST centers on what it calls biometric identity binding for trusted chips. In English: creating a system where a semiconductor device can cryptographically prove it’s associated with a specific, verified human being.


Share: